Quality is Our Cultural Cornerstone

At SEMICORE, quality is not a checkpoint—it is the foundation of trust. Every component carries our commitment to integrity.

7-Stage Verification Protocol

1

Source Approval

Factory audits and supplier qualification.

2

Documental Forensics

Verifying OEM certificates and chain-of-custody.

3

Visual Analysis

Microscopic inspection of markings and dimensions.

4

Electrical Testing

Parametric and functional validation.

5

Material Analysis

XRF, C-SAM, and Decapsulation for deep verification.

6

Data Integration

Digital recording of all test results.

7

Final Release

QA Manager review and CoC generation.

Advanced Material & Structural Analysis

For high-risk, high-value, or suspicious components, we deploy advanced forensic techniques to ensure absolute authenticity.

X-Ray Fluorescence (XRF)

Verifies elemental composition of lead finishes to ensure compliance and detect lead-free fraud.

Scanning Acoustic Microscopy (C-SAM)

Detects internal package defects like delamination or cracks invisible to the eye.

Decapsulation & Die Analysis

The ultimate verification. We chemically open the package to microscopically inspect the silicon die.

Microscopic Chip Analysis

Certifications & Standards

AS9120B
ISO 9001:2015
ISO/IEC 17025 (Pending)